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  • Automatic Precision Component Assembly with 1.5µm

    This eutectic die bonder is designed for fully automatic precision component assembly with 1.5µm placement accuracy (appliion dependent), making component assembly practical and cost effective. A specialized configuration of the 6500 Die Bonder for wafer scale packaging eutectic die bonding is an available option. 6500 Die Bonder Options

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  • Wafer Mounter linteceurope

    This is a high performance wafer mounter of highthroughput. The lineup consists of five product types that vary in accordance with fullyautomatic or semiautomatic functions, as well as wafer size.

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  • Production Wafer Probers Wentworth Laboratories

    Pegasus™ S300 wafer probers is an economical semiautomatic prober for testing full and partial wafers to 300mm, and is particularly effective for low volume probing, design verifiion, failure analysis and for probing packaged components.

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  • Automatic Ultrasonic Testing for Bonded Wafers Sonix

    Autowafer™: Automatic Ultrasonic Testing for Bonded Wafers Installed in more wafer appliions than all other automatic ultrasonic testing tools combined, AutoWafer provides a complete, productionready wafer scanner for wafers from 100mm to 200mm, including multiple sizes in a single batch.

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  • DIAS Automation Your Best Automation Partner

    Flexible input output configurations for WaferWafer, WaferTray, TrayTray Quick conversion Wafer / Tray Holders and tooling Option for output to Tape & Reel

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  • SIL – Automatic microscope wafer loader Semisyn

    SIL – Automatic microscope wafer loader . SIL8000 wafer autoloader represents the most effective system to automatically load wafers on a microscope. It is a compact unit, featured by a structure which makes possible to load wafers on almost any microscope without the need of complex interfaces and without need to change the microscope stage.

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  • Lambda Ace VM2200 VM3200 Series screenspe

    Two types of autofocus, laser and contrast, are standard. This enables the use of autofocus regardless of the film thickness and type. Measurement of 1 µm diameter spots is supported (with a 50X objective lens*). What's more, image alignment* enables automatic mapping of patterned wafers. *Optional

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  • Rapid Thermal Processing System RTP RTO RTA: c.RAPID 200

    c.RAPID 200 is a flexible, automatic Rapid Thermal Processing (RTP) system for providing uniform, controlled heating to silicon, germanium and compound semiconductor wafers and pieces under inert or reactive process ambients. centrotherm brings precise temperature and ambient control as well as automatic or semiautomatic wafer handling to

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  • Fully Automatic Wafer Tape Mounter S3 Alliance

    EXM1200X> 300mm Fullyautomatic Wafer Tape Mounter. A wafer tape mounter for wafers of 300mm. (optionally available: 8inches) All parameters important for attaching a wafer onto a frame can be controlled in the recipe.

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  • Datacon DS9000e Besi

    Datacon DS9000e Wafer to Frame Sorting up to 14,500 UPH The Datacon DS9000e is a high speed fully automatic die sorter with output to a frame or carrier. It handles any wafer sizes up to 300 mm and can therefore reconstruct wafers to different output form factors. This enables the transition to larger wafer

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  • US6021380A Automatic semiconductor wafer sorter/prober

    A method and apparatus for visually inspecting and sorting semiconductor wafers and the individual microcircuits or chips thereon. The preferred embodiment employs a scanner to obtain a virtual reality image of the wafer and all chips are identified and sorted by applying highspeed image processing routines. The resulting wafer map provides unique image controlled chip coordinates making the

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  • Die / Flip Chip Bonding CWI Technical Sales

    The Flip Chip Package Industry, which is replacing the old wire bonding technologies, uses flip chip bonders to attach wafer dies to the substrate directly. This highly advanced technology requires exceptional accuracy and highend vision inspection.

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  • Okamoto Corporation Products

    Fully Automatic wafer grinder with downfeed grinding method and Robotics wafer handling. Product Specifiions : GDM300 FullyAutomatic Wafer Grinder and Dual Polish InLine system for wafer thinning in production: 25 um capability. Integrated Edgegrinder optional. Noncontact laser thickness detection optional.

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  • HZNx25 P5 (Horizon Transfer Machine) mactronix

    As with all Mactronix wafer transfer systems, the Horizon Series may be configured to accommodate a wide range of Plastic, Teflon®, Metal, Quartz, Silicon Carbide, and Polysilicon carriers. PLC controlled enhancing the transfer machine's simplicity. With the push of a button, the machine transfers wafers safely and automatically.

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  • US9390949B2 Wafer debonding and cleaning apparatus and

    The automatic wafer handling module removes the semiconductor wafer from the debonding module and loads the semiconductor wafer into a wafer cleaning module for a cleaning process. This description relates to a wafer debonding and cleaning apparatus including an automatic wafer handling module.

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  • Automatic MultiChip Modules Bonder SMT

    ASM provides you the latest multichip modules packaging solution – MCM12 is a fully automatic packaging system together with high precision die bonding, flipchip bonding with up to 12inch wafer handling capability and SMD bonding.

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  • Model 4700 / Titan Specifiions ACCESSORIATI

    Model 4700 / Titan Specifiions Automatic Functions Alignment options Machine Vision or Dark field alignment Site by Site Alignment: 0.12um, 3 sigma Enhanced Global Alignment 0.12um, 3 sigma Auto Focus: Continuous site by site, or global Focus Gauge: Automatic compensation for environmental fluctuations, image tilt

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  • Product details Besi

    The Datacon 2200 evo plus die bonder for Multi Module Attach assembles all kinds of technologies on a triedandtested platform, enhanced with key features for higher bonding accuracy and lower costofownership. Besides unbeaten flexibility and full customization possibilities, this evolutionary machine offers higher accuracy with longterm stability using a new camera system and thermal

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  • DAGESERIES4300 SEMIAUTOMATIC BONDTESTING OF

    needed).2 referance points needed per wafer. • 460mm x 300mm XY stage. • Optional image capture system 90x to 180x. • 360 degree manual chuck rotation. • 360 degree loadtool rotation.Automatic during auto test,manual when under joystick control. • Safety interlocks on wafer chuck. • Frame protection for 300mm wafer.

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  • Untitled []

    Pack and unpack wafers Optional Configurations: Cassette to cassette Cassettes to coin stack in wafer box with separators between wafers Coin stack to cassettes Process cassettes to shipping containers and back Orient wafers with reference to flats or notches Invert wafers Read and record wafer codes Sort by wafer codes Randomized and

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  • Products Epiluvac

    Flexible reactor systems for WBG semiconductors . CVD epitaxy reactors for SiC and GaN. Epiluvac ER3 (NEW!)– Hotwall CVD reactor with automatic hot wafer loading New reactor chamber with innovative features for highest possible uniformity and yield

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  • 4800 Bondtester Nordson

    An optional fan filter unit and front doors can be added with Ionizers for clean room operation. Automatic Wafer Justifier The wafer justifier ensures warped wafers can be automatically clamped to the vacuum chuck prior to testing. Fan Filter Unit The 4800 Integra can

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  • Wafer Biscuits, Waffles, Sugarcones, Wafers, Ice Cream

    Watch video · GEMNI INTERNATIONAL is a Manufacturer of Fully Automatic Wafer Baking Machines and Flat Hollow Wafer Machines. Find the information and get Automatic Wafer Baking Machines and Flat Hollow Wafer Machines

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  • Measuring MicroscopeWafer Systems

    The McBain TMS150 and TMS200 measuring microscope systems use a unique combination laser displacement sensors, motion control technology and proprietary software to inspect features developed on wafers. This combination of technologies allows simultaneous over/under high

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  • Wafer Mounter Adwill:Semiconductorrelated Products

    H. Wafer Control System (Optional) With this system, an ID number on the wafer is read, the data is then converted to barcode, and a label is attached. The wafer control system makes it possible to establish FA (factory automation) for the assembly process.

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  • WSI Series Post Wafer Saw Machine Vision Inspection

    • Automatic wafer loader (optional) • Motorized wafer expansion system for 5" / 6" / 8" wafer • High resolution XY table • Wafer Map edit capability

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  • MagnaTran 7 Frogleg Robot brooks

    † Automatic wafer centering with external sensing † CE and SEMI S2 compliant Benefi ts † Compatible with stateoftheart cluster tools End Effectors Existing and optional custom design end effectors available AWC (Automatic Wafer Centering) with customer provided external sensors.

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  • Auto Wafer, Auto Wafer Suppliers and Manufacturers at

    Fully Set Auto mini wafer stick line This machine we adpot the PLC programed control with Touchscreen,with simply operation,it can control the specific weight of the stuff very accurately. best price wafer stick machine,it can make hollow wafer rolls, center filling wafer rolls,add the optional machine can also make pillow wafer, flatten wafer and wafer roll with chocolate coating.

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  • Automatic Flat Wafer Production Line KEHUA

    Wafer Baking OvenOur wafer baking system makes use of LPG or LNG to heat baking plates, and this process is controlled by a Mitsubishi PLC in which there is a PID controller used to regulate heating temperature automatically.

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  • Luva System,Inc.

    pattern recognition and auto alignment, automatic, rapid and accurate standard parameters∶ Icbo, Iebo, V(BR)CEO, V(BR)CBO, etc. automatic result classifiion, table output and graphics output

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  • FP3000 ACCRETECH (Europe)

    Automatic wafer alignment Automatic sample needle for contact point alignment Optional with multiple probing, needle cleaning, GPIB interface, sample inspection, printer, barcode reader, wafer ID reader, color camera and flat loader

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  • Automatic Single Wafer Presenter Reticle Storage

    The automatic single wafer presenter is designed to lift 1 (3prongOptional) wafer a time for visual inspection. The wafer selection is made by moving the selector knob to the specific wafer

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  • Semi Auto Wafer Mounter 967 Accelonix

    ADT 967 SemiAutomatic Wafer Mounting System is designed to automatically mount wafers on tape. Fast, accurate and bubblefree mounting ADT 967 SemiAutomatic Wafer Mounting System is an elegant and userfriendly product, with great value. The perfect choice for mounting.

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  • Full Automatic feeding wafer biscuit packaging machine

    Sep 20, 2016 · Bestar Full Automatic feeding wafer biscuit packaging machine production line,wafer biscuit packing machine production line,wafer packaging machinery,wafer biscuit filling machine,wafer sachet

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  • Gasonics Aura 1000 Upgrade Allwin21 Corp.

    The robust integrated robotic wafer transfer is optional for much better wafer transfer, far less wafer breakage ($!), and higher MTBF. AW1000 System Control Key Features Maintenance, Manual, Semi Automatic and Full Automatic operation modes

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  • Automatic Wafer Production Line kingsunmachinery

    FulllyAutomatic Wafer Production Line. Feature: Adopting advanced technology with elctric and gas as heating source,this fullauto wafer production line is a new generation product developed exclusively in China based on the advanced structure of existing plants from domestic market and abroad.If offers an ideal solution for lower power consumption and overall production cost,and keeping the

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  • MRSI Systems MRSIM3 3Micron Die Bonder

    Direct Pick from Wafers minimizes die handling and simplifies supply chain – The MRSIM3's automatic wafer feeder includes automatic theta compensation, servo controlled synchronized closed loop movement of the pick head and the ejection needle, wafer mapping, ink dot detection, and fast change ejection needle clusters.

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  • SWIFT" Wafer Baking Line R&D Engineers

    Display (Optional) Automatic Wafer Baking Machine : SW Series n 24 or 42 baking tongs. n Electronic batter depositing control. n Baking plate size: 460 x 290mm. n Automatic wafer sheet takeoff system. n Baking plate Engraving on request. n Exhaust dampers above oven provided. n Fully automatic Imported Gas train.

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